As we construct as much as the approaching launch of the AMD Ryzen 7 9800X3D, a newly leaked picture of the upcoming gaming CPU reveals it shorn of its heatspreader, exposing the silicon chips beneath. This AMD Ryzen 7 9800X3D delid image in flip hints at a key cause why this CPU is anticipated to run at increased clock speeds than earlier X3D fashions.
With the AMD Ryzen 7 9800X3D already anticipated to be the most effective gaming CPU round when it launches, there are a number of explanation why it has such a weight of expectation, together with it being primarily based on AMD’s newest 9000-series structure and together with an additional stack of L3 cache. Nonetheless, it may very well be a brand new association of its 3D V-Cache that ideas it over into really chart-topping territory.
The delidded CPU picture comes through WCCFTech, which doesn’t cite a supply for the picture; it simply states that the positioning has obtained it. Regardless, what it reveals is the acquainted association of current AMD CPUs, the place within the middle of the substrate sits a single bigger silicon chip, which is the CPU’s IO die, then off to the aspect is one other silicon chip and house for a second chip. The latter chip and house are the place two core advanced dies (CCDs) can sit, with these silicon chips containing the cores of the CPU.
Provided that the AMD Ryzen 7 9800X3D is anticipated to be an eight-core chip, and every CCD of current AMD CPUs has included eight cores, that is why we solely see one CCD on this picture of the delidded 9800X3D. In earlier X3D chips, the chip containing the 3D V-cache has been positioned on prime of this chip.
The attention-grabbing half, although, is that if we glance a bit nearer on the floor of this single CCD (beneath left), it seems to be uniform. That is in distinction to earlier X3D chips (beneath proper) the place we’ve been in a position to see clear strains on the floor of the chip that delineate the 3D V-Cache die and the small items of filler silicon which might be used to assist the cache die.
This hints at three potentialities. Both the brand new cache die is bigger than earlier than, and fills the whole prime floor of the CCD on which it sits, a brand new manufacturing methodology has meant the beforehand seen filler materials is now now not seen, or AMD has flipped the chip round, placing the cache chip beneath and the CCD on prime. It’s this latter choice that appears almost definitely, for a number of causes.
Earlier leaks concerning the AMD Ryzen 7 9800X3D field artwork and AMD Ryzen 7 9800X3D benchmark efficiency, have hinted on the chip having “2nd Era 3D V-Cache Know-how,” and “subsequent era 3D V-Cache Know-how.” These leaks additionally confer with the brand new cache design bringing “higher thermal efficiency” than beforehand.
Provided that it’s the CCD’s cores which might be kicking out probably the most warmth, if these at the moment are positioned on prime of the 3D V-Cache die, it will probably permit for them to be cooled extra effectively, in flip permitting the sooner clock speeds we’ve additionally seen rumored arriving with this chip. Particularly, whereas the 7800X3D ticks alongside at a peak of 5GHz, the 9800X3D is anticipated to peak at 5.2GHz. That’s not an enormous leap however a achieve is a achieve.
All that is nonetheless simply hypothesis, although, with no official phrase from AMD. Certainly, the one official point out from the corporate itself up to now is a confirmed AMD Ryzen 9000X3D launch date, with November 7 being earmarked for a launch. It’s speculated that the 9800X3D would be the solely chip launched on this date however once more that is unconfirmed.
Whereas we wait to see precisely what this date has in retailer for us, you will discover out the easiest way to maintain your doable new 9000X3D chip cool by looking at our greatest CPU cooler information.
